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"A TDR-Based Method for Pre-bond Testing of the Silicon Interposer in 2.5D ICs."
Libao Deng et al. (2019)
- Libao Deng, Ning Sun, Ning Fu, Liyan Qiao:
A TDR-Based Method for Pre-bond Testing of the Silicon Interposer in 2.5D ICs. I2MTC 2019: 1-6
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