This paper presents a new transient electro-thermal (ET) simulation method for fast 3D chip-level analysis of power electronics with field solver accuracy.
Nov 7, 2016 · This paper presents a new transient electro-thermal simulation method for fast 3-D chip-level analysis of power electronics with field solver ...
ABSTRACT. This paper presents a new transient electro-thermal (ET) simula- tion method for fast 3D chip-level analysis of power electronics.
This paper presents a new transient electro-thermal (ET) simulation method for fast 3D chip-level analysis of power electronics with field solver accuracy.
“A New Tightly-Coupled Transient Electro-Thermal Simulation Method for Power Electronics”. Q. Chen, W. Schoenmaker; ICCAD 2016 ICCAD, November 7-10, Austin TX ...
This paper presents a new transient electro-thermal simulation method for fast 3-D chip-level analysis of power electronics with field solver accuracy.
The electrical and the thermal model parts are combined, taking the interaction between both into account consistently. The electrical and thermal model ...
Missing: tightly- coupled
Abstract. This paper describes a novel electro-thermal coupling simulation technique for analyzing automotive IGBT modules. This technique uses a.
This work describes a nonlinear projection-based model order reduction (MOR) method specialized for tightly-coupled transient electro-thermal (ET) simulation
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Transient Electro-Thermal Coupled Modeling of Three-Phase Power ...
www.ncbi.nlm.nih.gov › PMC8467052
Sep 19, 2021 · This study introduces an effective and efficient dynamic electro-thermal coupling analysis (ETCA) approach to explore the electro-thermal behavior of a three- ...
Missing: tightly- | Show results with:tightly-