As process technology continues to shrink, interconnect current densities continue to increase, making it ever more difficult to meet chip reliability ...
This paper presents a true three-dimensional thermal analysis in order to accurately transform power dissipation into a temperature profile for more accurate ...
As process technology continues to shrink, interconnect current densities continue to increase, making it ever more difficult to meet chip reliability ...
May 25, 2017 · Bibliographic details on Switching constraint-driven thermal and reliability analysis of Nanometer designs.
This paper presents a true three-dimensional thermal analysis in order to accurately transform power dissipation into a temperature profile for more accurate ...
Apr 25, 2024 · Switching constraint-driven thermal and reliability analysis of Nanometer designs. ... nm high- performance SOI custom macro design. ISQED ...
ABSTRACT. Increasing current densities in deep sub necessitate accurate power and thermal analys compliance with chip-level reliability specifica.
... constraints for analysis of internal paths as well as. IO interfaces. Advanced modeling concepts such as composite current source (CCS) timing and noise ...
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Switching constraint-driven thermal and reliability analysis of Nanometer designs · Engineering, Materials Science. IEEE International Symposium on Quality…
As process technology continues to shrink, interconnect current densities continue to increase, making it ever more difficult to meet chip reliability targets.