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"Chip-level TSV integration for rapid prototyping of 3D system LSIs."
Kazuyuki Hozawa et al. (2011)
- Kazuyuki Hozawa, Futoshi Furuta, Yuko Hanaoka, Mayu Aoki, Kenichi Takeda, Katsuyuki Sakuma, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi:
Chip-level TSV integration for rapid prototyping of 3D system LSIs. 3DIC 2011: 1-4
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