Abstract: In this paper we propose two synthesizable 3D network architectures: C-LIN and D-LIN, which allow modular stacking of multiple L1 memory dies over ...

In this study, the authors propose two 3D network architectures: C-logarithmic interconnect (LIN) and Distributed logarithmic interconnect (D-LIN) (designed in ...

Abstract—In this paper we propose two synthesizable 3D network architectures: C-LIN and D-LIN, which allow mod- ular stacking of multiple L1 memory dies ...

These results demonstrate that, in processor-to-L1-memory context, C-LIN and D-LIN perform significantly better than traditional network on chips and simple ...

1) The document proposes two 3D network architectures (C-LIN and D-LIN) that integrate 3D stacking technology to provide tightly coupled access to shared memory ...

We propose two synthesizable 3D network architectures: C-LIN and D-LIN, which can be integrated with 3D Stacking technology to provide access to tightly.

Sep 1, 2013 · In this paper, we take advantage of three-dimensional (3D) technology to increase the shared L1 memory size in a modular fashion, that is, ...

3D logarithmic interconnect: stacking multiple L1 memory dies over multi-core clusters. E Azarkhish, I Loi, L Benini. 2013 Seventh IEEE/ACM International ...

May 8, 2024 · 3D logarithmic interconnect: Stacking multiple L1 memory dies over multi-core clusters. NOCS 2013: 1-2; 2012. [j4]. view. electronic edition via ...

In this paper, we present a synthesizable 3-D-stackable L2 memory IP component, which can be attached to a cluster-based multicore platform through its network- ...