Mar 17, 2022 · We introduce HBM3 DRAM, which employs multiple new features and design schemes. Techniques such as an on-die ECC engine, internal NN-DFE I/O signaling, TSV ...
Aug 17, 2022 · This article introduces a 192-Gb 896-GB/s 12-high stacked third-generation high-bandwidth memory (HBM3 DRAM) with low power consumption and high-reliability ...
A 192-Gb 12-High 896-GB/s HBM3 DRAM with a TSV Auto-Calibration Scheme and Machine-Learning-Based Layout Optimization · Myeong-Jae Park, H. Cho, +46 authors
Layout. Conference Paper. A 192-Gb 12-High 896-GB/s HBM3 DRAM with a TSV Auto-Calibration Scheme and Machine-Learning-Based Layout Optimization. February 2022.
A 192-Gb 12-High 896-GB/s HBM3 DRAM With a TSV Auto-Calibration Scheme and Machine-Learning-Based Layout Optimization. Park, Myeong-Jae; ;; Lee, Jinhyung; ; ...
This article introduces a 192-Gb 896-GB/s 12-high stacked third-generation high-bandwidth memory (HBM3 DRAM) with low power consumption and high-reliability ...
A 192-Gb 12-High 896-GB/s HBM3 DRAM with a TSV Auto-Calibration Scheme and Machine-Learning-Based Layout Optimization. https://doi.org/10.1109/isscc42614.
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