Abstract- An ultra-fast temporary bonding and release process was investigated for the improvement of 3D integration. The bonding scheme composes of two ...
HD-3007 polyimide adhesive layer is spin-coated and fully imidized at 300 o C for 30 min on the device wafer before bonding. The photolysis polymer has been ...
Characterization of Temporary Bonding and Laser Release Using Polyimide and a 300-nm Photolysis Polymer System for High-Throughput 3-D IC Applications.
An ultra-fast temporary bonding and release process based on thin photolysis polymer in 3D integration. Tsung-Yen Tsai, Chien-Hung Lin, Chia-Lin Lee, ...
A submicron photolysis polymer temporary bonding with ultra-fast laser de-bonding process of less than 20 s has been demonstrated where both photolysis ...
A new temporary bonding technology with an ultrafast laser-release process of less than 20 s is presented, where a 300-nm-thick photolysis polymer and ...
An ultra-fast temporary bonding and release process was investigated for the improvement of 3D integration. The bonding scheme composes of two different ...
Tsai, An Ultra-Fast Temporary Bonding and Release Process Based on Thin Photolysis Polymer in 3D Integration, с. 169; Cheng, Characterization of temporary ...
An ultra-fast temporary bonding and release process based on thin photolysis polymer in 3D integration. TS8.8.1-TS8.8.5. view. electronic edition via DOI ...
VIII-8 An Ultra-Fast Temporary Bonding and Release Process Based on Thin Photolysis Polymer in 3D Integration. Tsung Yen Tsai1, Chien Hung Lin2, Chia Lin ...