This work investigates the thermal interactions between two hybrid bonded dice for different case scenarios. A specific test vehicle comprising heaters and ...

Abstract— Direct hybrid bonding is considered as one of the most promising technologies for high performance 3D-ICs. Its face-to-face structure allows ...

Direct hybrid bonding is considered as one of the most promising technologies for high performance 3D-ICs. Its face-to-face structure allows significant ...

This work investigates the thermal interactions between two hybrid bonded dice for different case scenarios and studies variables such as silicon thickness, ...

Request PDF | On Nov 1, 2016, R. Prieto and others published Heat spreading packaging solutions for hybrid bonded 3D-ICs | Find, read and cite all the ...

This work investigates the thermal interactions between two hybrid bonded dice for different case scenarios. A specific test vehicle comprising heaters and ...

Rafael Augusto Prieto Herrera, P. Coudrain, J.P Colonna, Y. Halez, C. Chancell, et al.. Heat Spreading Packaging Solutions for Hybrid Bonded 3D-ICs.

Bibliographic details on Heat spreading packaging solutions for hybrid bonded 3D-ICs.

The passive heat spreader is most commonly used material which has high thermal conductivity such as copper, aluminium or diamond, where as active heat spreader ...

Jun 27, 2024 · Many papers highlighted thermal challenges and some solutions were discussed. TSMC presented its development of an energy-efficient Si- ...